About the Company

Vertical Circuits Inc., based in Scotts Valley, CA, develops and licenses advanced 3D conformal interconnect packaging technologies that enable its customers to manufacture of low-cost, ultra high-speed, high-density semiconductor components.  Vertical Circuits die level interconnect solutions were originally developed and implemented in aerospace and military electronics that require the highest standard of quality and reliability and were subsequently used in volume production for high speed server memory modules.  Today, Vertical Circuits  has leveraged its technology leadership and expanded the adoption of its conformal interconnect solutions to  an even broader range of advanced 3D packaging  applications – including both die and package level implementations - focused on meeting the semiconductor and electronics industry’s growing demand for high density, small form factor packaging. 

Our company’s overall drive for excellence includes a commitment to the development and well being of our employees.  As an employee, you would be eligible to participate in a comprehensive benefits package including a competitive salary, stock options, Medical, Dental, Paid Time Off, 401(k) with company match, life insurance, flexible spending plans, and short/long term disability coverage.

About the Opportunity

VCI is looking for a highly-motivated individual to fill a senior engineering position in our process/product development team as the lead in product development. You will be responsible for the development of innovative products and processes that use the deposition of conductive pastes as interconnects.  Deposition methods can include dispensing, screen-printing, pressure-filling, or any viable method of 20-200 micron scale application of conductive ink.  You will also be responsible for the qualification of fine-pitch, high-volume electrical conductors in electronic component assembly, as driven by a key Tier-1 Silicon Valley customer.  The role will be hands-on, but will require a mature level of program management (including close vendor and customer facing roles).  You must have the ability to effectively manage people (internal and external) to deliver a specific technology goal in a defined period of time.  You must have experience in semiconductor materials, print electronics or any other applicable discipline.  You must have a strong knowledge of process/equipment/material interaction, and preferably recent training/experience in data based process analysis.  The primary function of the role is problem solving.  The position will be part of the R&D team and will have a leadership and program management role in the development and qualification of key customer products within VCI.

Education and Experience

• MS (Chemical, Mechanical, Electrical, Materials Engineering) with 10+ years experience or PhD with 7+ years experience in relevant technologies.
• Must be very strong in hands-on product development with a track record of productization.
• Must have strong and demonstrate problem solving skills – including data based analysis, quality/manufacturing understanding, and deep problem solving skills.
• Must be a highly effective communicator with a need to program manage vendors, customers and peers.  Needs to work in a team, but to have individual ownership of complex tasks (in a start-up environment).
• Technology expertise in semiconductor, package assembly is a must.  The position will lead aspects of product/equipment/process selection, development and qualification within VCI and for key customers.
• Semiconductor, Assembly, Solar, Print Electronics or any other relevant discipline can be considered, but must have a solid understanding of stacked-IC assembly.
• Travel requirements <10%